TECHNOMELT TC 50 

,TECHNOMELT TC 50First-ever thermally conductive low pressure molding material 导热低压成型材料TECHNOMELT TC 50 high performance, filled thermoplasticpolyamide is formulated for use as a protective encapsulant for heatgenerating devices requiring thermal management. This material canbe handled at low processing pressure, allowing encapsulation offragile comTECHNOMELT TC 50